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FPGA Mezzanine Card (FMC) Breakout Board


+ANSI/VITA 57.1 compliant

+Commercial grade form factor

+Low-pin count (LPC) connectors

+Breakout of carrier card connector

+Breakout of mezzanine card connector

+Stackable assembly

+Separate breakout of power pins

+Breakout pads with 1.27 mm pitch

+Prototyping area with 2.54 mm grid

+Open-source hardware

+Easy prototyping

+Testing and debugging of FMC modules

+Research and education with FPGAs

The FMC LPC Breakout board is a passive adapter for accessing all signals of ANSI/VITA 57.1 FPGA Mezzanine Card (FMC) Standard compliant low-pin-count (LPC) connectors. All pins of the connector's rows C, D, G, and H are routed to a separate pad array on the top and bottom side. These pads were placed at a 1.27 mm pitch to easily attach additional probes or solder wires. For special measuring tasks or for use as a stand-alone carrier, the power pins of the connector were routed to additional vias in the back of the module. Furthermore, simple electrical circuits can be realized on the prototyping area, which is a field of non connected vias with a pitch of 2.54 mm. The FPGA mezzanine card has commercial grade form factor (single width, 78.80 mm x 69 mm) and is designed for air cooling.

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The full datasheet is available at .